Ytmontering, hålmontering, CAD, konstruktion, design. Vi har alla byggstenarna inom elektronik och erbjuder dem till våra kunder.

 Ytmontering och montering av SMD på kretskort hos ytmontera .com. Vi arbetar i huvudsak med mindre serier där våra kunder önskar samtida leverans av 5 - 1000 kretskort per tillfälle.

 Någon elektronik i pipe-line? Som underleverantör, legotillverkare, kontraktstillverkare lämnar vi gärna priser för ytmontering av kretskort och SMD. Vi utför din produktion / legotillverkning.

Elektronikmontering av SMD elektronik hos ytmontera .se

Kretskort med ytmontering och hålmonterad elektronik

Ytmontering av SMD elektronik hos ytmontera .se

För bra pris och hög kvalitet på montering av kretskort kontakta 060-578955  eller E-mail:  info @ ytmontera .se

 Ytmontering av lika typer av komponenter ned till 0402. På bilden visas en MELF diod. Vi hanterar de flesta ytmonterade komponenter med hög kvalitet vid montering av elektronik på kretskort (SMD lego). CAD. Elektronikutveckling. Hålmontering. Lego elektronik.

Utveckling elektronik


 Prototypkort och prototypmontering av mönsterkort till kompletta kretskort med ytmontering och hålmontering. Vi lämnar fasta priser och snabba leveranstider.

Ytmontering av kretskort

Vi arbetar med elektronik, elektronikmontering och produktion av kretskort. I första hand är det ytmonterade kretskort som är vårt arbetsområde.

 

Det som är speciellt med oss är att vi utför automatisk montering i små och mindre serier av kretskort. Man är således välkommen till oss med serier om 25 eller 300 st. Vi har anpassat verksamheten för mellan 5 och 500 st kretskort per omgång i produktion.

 

Här nedan är en liten ordlista med förkortningar inom elektronik, produktion och elektronikmontering / elektronikmontage och som kan vara bra att ha till hands. Välkommen till www.ytmontera.com oavsett om det enbart gäller att titta i ordboken eller att fråga oss om ett pris. Välkommen!

 

 

ACI - Automatic Component Insertion - komponenter och montering i produktion

 

ANSI - American National Standards Institute - standardisering

 

AOI - Automated Optical Inspection. Test fixture method in which printed circuit boards

are checked at bare-board, pre-or post-soldered stages of assembly by optical

means.  - automatisk optisk test av kretskort inför och i produktion / tillverkning .

 

ASIC - Application Specific Integrated Circuit - kretsar

 

ASM - American Society of Metals - normer

 

ASTE - American Society Test Engineers - test

 

ASTM - American Society for Testing and Materials - test

 

ASQC - American Society Quality Control - kvalitet och kontroll

 

ATE - Automatic Test Equipment. Equipment designed to automatically analyze

functional or static parameters in order to evaluate performance degradation. It

may also be designed to perform fault isolation.  - test i produktion av kretskort

 

ATG - Automatic Test Generation. Computer generation of a test program based solely

on the circuit technology, requiring little or no manual programming ef fort.  - test av kretsar och kretskort i produktion

 

BGA - Ball Grid Array. A component whose terminations are on the bottom of the

package, and are in the shape of solder balls and in a grid array pattern. This

generally covers components that have them in a full array or in a partial array

with “missing” balls in the center.  - komponenter

 

CAD - Computer Aided Design. A computer based system to assist designers in the

design, topological layout and drawing of an electronic component, assembly, or

system.  - rita upp mönsterkort

 

CBGA/CCGA - Ceramic Ball Grid Array/Ceramic Column Grid Array. A grid array packaged

component that has ceramic as the substrate of the package, and may have

either solder balls or solder columns for connections.  - komponenter

 

CFC - Chlorinated Fluorocarbon.

 

CMA - Circuit Mil Area. A unit of area equal to the area of a circle whose diameter is

one mil (0.001”). Used chiefly in specifying cross-sectional areas of conductors.  - måttenhet mönsterkort

 

CMOS - Complementary Metal Oxide Semiconductor - komponent för kretskort

 

CMT - Chip Mount Technology. Any packaging or electronic assembly manufacturing

technology, such as TOB, COB, or flip chip, that connects bare (unpackaged) IC

chips to the substrate.  - montering av oskyddade komponenter

 

COB - Chip-on-Board. A situation where the silicon IC chip is mounted directly to the electronic assembly substrate or PWB without an intermediate packaging step.

Connections between the chip and the board are generally made with lbond wired

(also sometime called ‘chip and wire’), but the terminology is occasionally used for

any chip connection technique such as flip chip (solderable bumps or tape

automated bonding.  - montering och produktion kretskort

 

CSP - Chip Scale Package. Active, multi-I/O package that is no larger than 125% of the

size of thesilicon IC.  - produktion

 

CTE - Coefficient of Thermal Expansion. See TCE

 

DFM - Design for Manufacturability

 

DFT - Design for Test

 

DIL - Dual In-Line. Component shape with two parallel rows of connection leads.  - kapsling av kretsar för produktion

 

DIP - Dual In-Line Package. A popular through hole package with leads in rows on

opposite sides of the package.  - kapsling av kretsar för produktion

 

DRAM - Dynamic RAM. Read-write memory that must be refreshed (read or written into)

periodically to maintain the storage of information.  - minnestyp

 

DUT - Device Under Test. Component, PCB, or assembly subjected to a test. Also

known as unit under test (UUT) and loaded board.  - test i kretskort och produktion

 

EIAJ - Electronic Industries Association in Japan

 

ESD - Electrostatic Discharge. A transfer of electrostatic charge between bodies at different electrostatic potentials caused by direct contactor induced by an

electrostatic field.  - elektrostatisk urladdning

 

ESS - Environmental Stress Screening. Manufacturing stage in which all assemblies

are subjected to abnormal stresses, with the aim of forcing all early failures to

occur. Also known as reliability testing.  - stresstest och test av pålitlighet

 

FCA - Flip Chip Attach. The technique of attachment of an IC chip to a substrate using

solderable bumps between the silicon chip and substrate.  - kretsteknik

 

FPT - Fine Pitch Technology. The portion of surface mount technology that included

components that typically have lead pitch, or center-to-center spacing, between

0.4mm and 0.8mm.  - montering kretskort / ytmontering

 

FP - Flat Pack. Allow profile IC package, which typically has gull wing type of leads

on two or four sides.  - typ av kapsling kretsar

 

FR-4 - The most commonly used epoxy-fiberglass material standard for printed circuit boards. The “FR” refers to flame retardant.  - PCB / kretskort bas

 

HASL - Hot Air Soldered Leveled. Hot air is used to blow of the excess after the PWB is dipped in solder. Typically used with the SMOBC process.  - montering komponenter kretskort hetluft

 

IC - Integrated Circuit. A small, complete circuit made by vacuum deposition and

other techniques, usually on a silicon chip, and mounted in a package.  - integrerad krets

 

IEEE - Institute of Electrical and Electronics Engineers - standard

 

ILB - Inner Lead Bonding. Process of bonding termination, which leads to a tape

automated bond integrated circuit’s bumps.  - processteknik

 

IMAPS - International Microelectronics and Packaging Society.

 

IMC - Intermetallic Compound. Metallic compounds that form at the interfaces between

different metals, such as copper-tin compounds that form at the interface of a

solder joint and a copper lead. IMCs typically have significantly different

properties, such as tensile strength.  - sammanbyggnad produktion

 

IPC - Institute for Interconnecting and Packaging Electronic Circuits

 

IR - Infrared. Soldering process that uses infrared energy as the primary method of

heating.  - infraröd lödning i produktion av kretskort

 

ISO - International Standards Organization.  - standard

 

JEDEC - Joint Electronic Devices Engineering Council, apart of the Electronic Industries Association (EIA) that publishes specifications and standards for electronic components.  - specifikationer och standarder

 

KGB - Known Good Board. A correctly operating PCB. It is used in learning or

debugging a test program in development and for comparison testers where it

serves as the standard unit by which other PCBs are compared.  - referenskort vid test i produktion

 

KGD - Known Good Die - se KGB

 

LCCC - Leadless Ceramic Chip Carrier (or CLCC for Ceramic Leadless Chip Carrier). A

hermetically sealed ceramic package that has pads (castellations) around its

sides for solder connection in a surface mounting application.  - typ av kapsling för ytmontering

 

LDCC - Leaded Ceramic Chip Carrier. A hermetically sealed ceramic package that has

leads around its sided for solder connection in a surface mounting application.

Typically, thee packages have over 28 leads.  - typ av kapsling för ytmontering

 

LSI - Large Scale Integration. Arrays of ICs on a single substrate that comprise 100 or more individual active circuit functions or gates.  - benämning packning av komponenter

 

MCM - Multichip Module. A circuit comprised of two or more silicon devices bonded

directly to a substrate by wire bond, TAB, of flip chip.  - modul med flera kretsar

 

MELF - Metal Electrode Face Bonding. A cylindrical leadless component with a round

body and metals terminals on the ends.  - benämning kapsling för ytmontering, t.ex dioder

 

MLB - Multi Layer Board. A PWB that has more than two conductor layers. The layers

are interconnected by the plated-through holes.  - kort med flera lager för ledningsdragning

 

MSD - Moisture Sensitive Device.

 

MTBF - Mean Time Between Failures. The arithmetic or statistical mean average time

interval, usually in hours, that may be expected between failures of an operating

unit. Results should be designated actual, predicted, or calculated.  - beräkningsgrund för medeltid mellan felintervall

 

MTTF - Mean Time To Failure. Average time between failures.  - beräkningsgrund för medeltid till fel

 

MTTR - Mean Time to Repair. A measure of how long it takes to access a failed system and identify, locate, and repair the fault.  - beräkningsgrund för medeltid att lokalisera och reparera fel

 

OSP - Organic Solder Preservative. Layers of organic coatings applied to entire boar surfaces to prevent oxidation and to retain solderability.  - monteringsteknik

 

PBGA - Plastic Ball Grid Array. A ball grid array component whose package substrate is

made of plastic, most likely an FR-4 equivalent of epoxy-fiberglass, polyimide-

arramid, or similar resin-fiber combinations.  - kapsling

 

PCA - Printed Circuit Assembly. The generic term for a PCB after all electrical

components have been attached. Also referred to as a printed wiring assembly

(PWA).  - färdigmonterat kretskort

 

PCB - Printed Circuit Board. A part manufactured from a rigid base material upon

which a completely processed printed circuit has been formed.  - kretskort / mönsterkort ( "tryckt ledningsdragning" )

 

PGA - Pad Grid Array. Similar to a pin grid array. An IC package that has solderable

connections in a grid layout on the bottom of the package, and is soldered to the

surface of the substrate (PWB) with but solder joints.  - kapsling

 

PCMCIA - Personal Computer Memory Card International Association. The organization

that has developed the early standards for the various sizes of modules which

were initially for memory expansion but are now used for many different

electronic functions.  - känd för standard av t.ex. minneskorts, även kallat PCCARD .

 

PLCC - Plastic Leaded Chip Carrier. A plastic IC package for surface mounting

Applications that has leads, generally “J” leads, on al fours sides (sometimes

given as PCC or PLDCC).  - kapsling komponent

 

PPM - Parts Per Million

 

PQFP - Plastic Quad Flat Pack. An FP with leads on fours sides. Generally refers to a plastic quad flat package that is built to JEDC standards.  - kapsling komponent

 

PTH - Plated Through Hole. An interconnection from one side of a PWB (PCB) to

another that is formed with the copper plating of the via (hole) sidewalls.  - anslutningar mellan ena kretslagret till andra på ett kretskort

 

PWA - Printed Wiring Assembly. The generic term for a PWB after all electrical

components have been attached.  - monterat mönsterkort / kretskort

 

PWB - Printed Wiring Board. The substrate, generally epoxy glass, used to provide

component attachment lands and interconnections to form a functioning

electronic circuit (also called a PCB or printed circuit board).  - mönsterkort / kretskort

 

QFP - Quad Flat Pack. A FP with leads on four sides. Generally refers to a plastic

quad flat package that is built to EIJ standards.  - kapsling komponent

 

QPL - Qualified Products List. A listing of manufacturers qualified by test and

performance verification to produce items listed in the MIL specs.  - lista av kvalificerade tillverkare för MIL (militärspecificerade)

 

QSOP - Quarter-Size Smal Outline Package. An SO style IC package that has leads on

a 25 mil pitch. The name derives from the fact that the package is approximately

½ the length and ½ the width of a standard SOIC, and thus a package of the

same pin count occupies approximately ¼ the area on a PWB.  - kapsling komponent

 

RAM - Random Access Memory. A type of memory that offers access to storage

locations within it by means of X and Y coordinates.  - typ av minne och hantering av minnesposition

 

RCC - Rectangular Chip Carrier. A chip carrier with unequal length and width

dimensions.  - kapsling

 

ROM - Read Only Memory. A random access storage in which the data pattern is

unchangeable after manufacture.  - förprogrammerat minne för enbart läsning

 

SCC - A chip carrier with a square body.  - kapsling

 

SIP - Single-In-Line Package. An IC package or multi-component sub-assembly that

has connections or leads in a single row on one side.  - kapsling komponent

 

SIR - Surface Insulation Resistance

 

SMA - Surface Mount Assembly. An electronic assembly or module that is

manufactured with surface mounted components and suing surface mount

technology.  - ytmontering

 

SME - Society of Manufacturing Engineers

 

SMTA - Surface Mount Technology Association

 

SMC - Surface mount components. Any electrical or mechanical component that can be attached to the surface of a substrate with solder.  - ytmonterade komponenter

 

SMD - Surface Mount Device.  - ytmonterad enhet

 

SMOBC - Solder Mask Over Bare Copper. A printed wiring board manufacturing technique whereby solder mask is applied over bare copper, exposed and developed, and then the board is dipped in molten solder to coat the exposed copper.  - teknik för att förbereda kretskort för montering av komponenter

 

SMT - Surface Mount Technology. The technology used to manufacture electronic

assemblies using components that are soldered directly to the surface of the

substrate or PWB.  - teknik för ytmontering av kretskort

 

SO - Small Outline. A package resembling a flat pack with leads on only two sides.  - kapsling komponent

 

SOIC - Small Outline Integrated Circuit. A plastic IC package for surface mounting

Applications that has leads on two opposite sides.  - kapsling komponent

 

SOJ - A plastic IC package with “J” leads on two sides. It resembles a plastic DIP or an SOIC except for lead spacing and forming.  - kapsling component

 

SOL/SOW - Small Outline-Large/Small Outline Wide. SO generally refers to a package that

is approximately 150 mils wide, while SOL/SOW refers to packages that are

approximately 300mils wide.  - kapsling komponent (2 olika bredder)

 

SOP - VSOP/SSOP. Another designation for the small outline ICP packages, i.e. Small

Outline Package (Very Small Outline Package, Shrink Small Outline Package) - kapsling komponent

 

SOT - Small Outline Transistor. A plastic leaded package for diodes and transistors

used in surface mounting applications.  - kapsling komponent

 

SPC - Statistical Process Control. The use of statistical techniques to analyze a

processor its output to determine any variation from a benchmark and to take

appropriate action to restore statistical control, if required.  - statistisk analys

 

SSOIC - Shrink Small Outline IC. An SO style IC package that has leads on a 25 mil

pitch.  - kapsling komponent

 

TAB - Tape Automated Bonding. An IC interconnection process that uses organic tape

to support pre-formed leads during bonding to the chip (inner lead bonding-ILB)

and connection to the substrate (outer lead bonding-OLB). The IC chip is usually

bare during the interconnecting processes.  - monteringsteknik kretsar

 

TBGA  - Tape Ball Grid Array. A ball grid array component package that uses TAB

techniques to make the connections between the IC chip and the solder bals.

This results in a solder ball grid array that is only around the periphery, and

leaves compliant connections between the IC and the solder balls for better TCE

reliability.  - monteringsteknik kretsar

 

TCE (CTE) - Thermal Coefficient of Expansion (Coefficient of Thermal Expansion). The rate of expansion (ppm/C) of a material when its temperature is increased.  - variation beroende på temperatur

 

VFP  - Very Fine Pitch. The center-to-center lead distance of surface mount packages that are between 0.012 inch and 0.020 inch.  - benämning inom ytmontering

 

VLSI  - Very Large Scale Integration

 

VSP  - Vapor Phase Soldering. Soldering accomplished by using heat generated by the

condensing of a vapor ion a cooler assembly. VSP is achieved with SMT by

using a high temperature, approximately 215 degrees C, special prefluorinated

fluid.  - lödmetod

 

VSOIC - Very Small Outline IC. An SO style IC package that has leads with a pitch of 30 mils or less.  - kapsling komponenter

 

WOM - Write Only Memory. A non access storage. Not a real component but used as a joke.  - teknikhumor

 

0402 - benämning storlek för ytmontering på kretskort vid layout och produktion

 

0603 - benämning storlek för ytmontering på kretskort vid layout och produktion

 

0604 - benämning storlek för ytmontering på kretskort vid layout och produktion

 

0805 - benämning storlek för ytmontering på kretskort vid layout och produktion

 

1005 - benämning storlek för ytmontering på kretskort vid layout och produktion

 

1205 - benämning storlek för ytmontering, t.ex motstånd - kapsling komponent ( det finns ett antal olika sifferbenämningar beroende på komponentens storlek )

Automatisk montering av SMD komponenter i små och mindre serier. Elektronikmontering.

Lego, elektronikmontering, kontraktstillverkning, elektronik, produktion, flexibilitet, prisvärt. Gärna prototyper och nollserier.